OFERTA FORMATIVA DCM - FCT/UNL
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AnnealSys As-One 100 Rapid thermal processing
Location: Clean room CEMOP – thin-film deposition lab
Responsible: Pedro Barquinha
Description:
This tool allows for rapid thermal processes in substrates up to 4”, between RT and 1450 °C, with heating ramps up to 200 °C/s in multiple atmospheres.
Specifications:
• Up to 4” wafers
• Temperature range: RT to 1450 °C
• Temperature measurement via pyrometer and thermocouples
• Heating ramp up to 200 °C/s
• Vacuum range: atmosphere to 10-6 Torr
• 4 gas lines, controlled with mass flow controllers: Ar, O2, N2 and Ar:H2
• Fully controllable by PC, with the possibility to create multiple automated recipes.
Responsible: Pedro Barquinha
Description:
This tool allows for rapid thermal processes in substrates up to 4”, between RT and 1450 °C, with heating ramps up to 200 °C/s in multiple atmospheres.
Specifications:
• Up to 4” wafers
• Temperature range: RT to 1450 °C
• Temperature measurement via pyrometer and thermocouples
• Heating ramp up to 200 °C/s
• Vacuum range: atmosphere to 10-6 Torr
• 4 gas lines, controlled with mass flow controllers: Ar, O2, N2 and Ar:H2
• Fully controllable by PC, with the possibility to create multiple automated recipes.
